Upsiren UTP-8 thermal paste utilizes high-purity aluminum nitride with a thermal conductivity of up to 14.8 W/mK, effectively enhancing heat dissipation for electronic components like CPUs, GPUs, and SSDs. This high-performance thermal interface material offers rapid cooling and can replace traditional thermal pads. Its silica gel matrix automatically fills gaps, providing excellent insulation and high-temperature resistance. It's ideal for desktop computers, laptops, gaming consoles, and communication equipment.
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